110 notices from official UK procurement sources · last import 22 Aug 2026
Scottish Water · Scotland
Scottish Water is committed to supporting the transition to a low-carbon fleet and continues to expand its electric vehicle (EV) charging infrastructure across its estate throughout Scotland.<br/><br/>To support this objective, Scottish Water intends to appoint a single Contractor to provide a comprehensive end-to-end service for the supply, installation, commissioning, maintenance and repair of electric vehicle charging infrastructure throughout Scotland.<br/><br/>The appointed Contractor will be expected to work collaboratively with Scottish Water to support the ongoing development of its EV charging network, ensuring infrastructure is delivered safely, efficiently and in accordance with all relevant industry standards and legislation.<br/><br/>Further information can be found within section II.2.4) Description of the procurement of this advert.<br/><br/>Full scope information found within the PQQ documentation on the Scottish Water Atamis Portal. Please see link for the portal linked within this advert.
Highlands and Islands Enterprise · Scotland
The Framework is an alternative means of providing a range of practical hands-on support (not advice, which is available through HIE’s Specialist Advice Framework) to community organisations and social enterprises that lack the capacity or a particular skill-set to timeously progress an opportunity. This is added value support and must complement the existing social enterprise support ecosystem and, therefore, must not duplicate services already available via other HIE Frameworks e.g. Board Healthcheck and Skills Training or other public sector/public sector supported organisations, e.g. Business Gateway, Just Enterprise, etc. It is expected that these services will be required from November 2026 for an initial period of 3 years, with HIE having the option to extend for a period or periods together not exceeding 1 year following the Initial Term. The 3 year budget currently available to deliver this service is between GBP 400,000 and GBP 450,000 (excluding VAT). The total estimated value of the framework for the full framework duration including the extension is GBP 600,000, which is the value stated in this notice.
University of Strathclyde · Scotland
Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology – reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for a Matrix Plasma Asher.
University of Strathclyde · Scotland
Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology – reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for an Inductively Coupled Plasma Chemical Vapour Deposition System.
University Of Edinburgh · Scotland
The University of Edinburgh will very shortly be publishing an Invitation to Tender (ITT) via an Open Procedure to invite competitive tenders to establish contracting arrangements with a single supplier for a fully comprehensive planned and reactive maintenance service for the UoE Trend building energy management system (BEMS) and associated control equipment. Fully comprehensive includes for supply, replacement and commissioning of faulty items associated with the BEMS. In addition, the Contract includes the provision for planned upgrade works. The purchase of replacement equipment and provision for planned upgrades shall remain optional, at the sole discretion of the University, throughout the Contract Term. The Contract is across the entire University of Edinburgh estate, which includes approximately 47 sites, 1226 controllers, and 18952 hardware points. It is intended that the contract will in place for an initial term of 2 years with four options to extend for periods of 1-year each (2+1+1+1+1). Estimated Total Contract Value (over 6 years): 2,500,000 GBP excluding VAT Maintenance Services Estimated Total Value (over 6 years): 1,000,000 GBP excluding VAT Planned Upgrade Works Estimated Total Value (over 6 years): 1,500,000 GBP excluding VAT It is important to note that these values are estimates only. The University will not guarantee these spend levels or any volume of business under this Contract. There shall be no obligation on the part of The University of Edinburgh to issue orders in relation to replacement equipment and provision for planned upgrade works aspects of this Contract to the appointed Service Provider. Full requirements are detailed in the tender documents.
University of Strathclyde · Scotland
Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology – reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for a High Accuracy Motion Control and Imaging System.
Dundee Industrial Heritage SCIO (Dundee Heritage Trust) · Scotland
Dundee Heritage Trust is seeking an experienced capital Project Manager to lead a programme of work at Discovery Point as part of its major museum transformation project. The Project Manager will oversee all aspects of project management relating to capital works to the building and exhibitions fit-out, including timetable, budgets, contracts, and procurement.
Partick Housing Association Ltd. · Scotland
Partick Housing Association wishes to Contract with a single Main Contractor who will undertake maintenance and servicing works to their gas fed CHP system which services 87 residential units within a recent housing development at Centurion Way, Partick, Glasgow. The contract will include a requirement to provide a 24 hour emergency call out service, which will include being contacted by individual residents as well as PHA staff.
Fife Council · Scotland
Provision of business support services for Fife Council sites.
Heriot-Watt University · Scotland
The University is seeking to appoint a Contractor to provide a planned maintenance service to the installed air conditioning/cooling systems, chilled water systems and associated plant control and services at its main Edinburgh campus, the Jean Muir Student Village in Galashiels, which consists of three residential buildings, and the High Mill Building. Also included is Panmure House, situated in Edinburgh city centre. Across these sites, the mechanical plant infrastructure includes a diverse mix of comfort heating and cooling systems as well as process‑cooling equipment. Assets include packaged chillers, VRV/VRF systems, split air‑conditioning units, close‑control units, and DX coil systems.
West Lothian Council · Scotland
Maintenance, Repair & Replacement of Refrigeration Units
University of Strathclyde · Scotland
Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology – reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for wafer-level optical tester(s) capable of performing characterization of both surface-emitting Distributed Feedback (DFB) laser arrays and silicon photonic integrated circuits (PICs).
NHS Highland · Scotland
NHS Highland requires Inpatient Medical Cover at Nairn Town & County Hospital
University Of Edinburgh · Scotland
Procurement of bioreactor equipment for the Biomanufacturing Hub at Edinburgh University for processing carbon based waste.
Lothian Health Board · Scotland
NHS Lothian wishes to create a framework to appoint suitable suppliers capable of providing heavy engineering related services as per the ITT documents.
Jobs and Business Glasgow · Scotland
Jobs and Business Glasgow (JBG) requires the organisation's assets and activities to be adequately covered by insurance provided by reputable and regulated insurers. Any subsidiary company of JBG must also be covered. The requirement also includes statutory engineering inspections at various sites.
Jobs and Business Glasgow · Scotland
Jobs and Business Glasgow (JBG) requires the organisation's assets and activities to be adequately covered by insurance provided by reputable and regulated insurers. Any subsidiary company of JBG must also be covered. The requirement also includes statutory engineering inspections at various sites.
East Ayrshire Council · Scotland
This is a re-opening of an existing framework. Current providers need not reapply. Existing providers were notified in March and June of 2024 or November 2025. The Council seek procure a Framework of training providers which will incorporate the requirements of East Ayrshire Works with the needs of the Workforce and Future Skills team. The Framework will be split into two lots with the needs of each individual service.
East Ayrshire Council · Scotland
This is a re-opening of an existing framework. Current providers need not reapply. Existing providers were notified in March and June of 2024 or November 2025. The Council seek procure a Framework of training providers which will incorporate the requirements of East Ayrshire Works with the needs of the Workforce and Future Skills team. The Framework will be split into two lots with the needs of each individual service.
University of Strathclyde · Scotland
Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology – reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for automated laser chip tester capable of performing burn-in testing.
Clackmannanshire Council · Scotland
partner provider status to providers of Early Learning and Childcare services for children entitled to statutory pre-school services.
Aberdeen City Council · Scotland
This is an ITT to provide Energy Advice 740Services. The Council requires a supplier to carry out the provision of a free impartial information, advice and support service on all aspects of fuel poverty and energy efficiencies. This is in order to help alleviate fuel poverty, improve the energy efficiency of housing, maximise residents’ income and reduce carbon emissions within the local area
University of Strathclyde · Scotland
Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology – reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for waveguide writing equipment capable of performing waveguide writing using laser beam for photonics packaging applications.
University of Strathclyde · Scotland
Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology – reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for optical alignment and packaging system to perform various active and passive alignment functions for photonics packaging applications.
University of Strathclyde · Scotland
Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology – reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for an advanced Hermetic Sealing capability consisting of Seam Sealing and Projection Welding of hermetic packages used in photonic and advanced semiconductor packaging.